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LeEco Le 2 spotted on benchmarking website.

It was reported that MediaTek’s Helio X25 chipset will be exclusive to Meizu for their Pro 6 handset which is expected to be launched very soon. Mediatek Helio X25 is a Deca-Core(10-Core) chipset with two A-72 architecture ,four A-53 cores big ones and four A-53 smaller ones.

But now it seems like other vendors are also getting attracted towards the Helio X25 chipset. The LeEco Le 2 phone has been leaked on the GFXBench website which is a very popular benchmarking website.

The LeEco Le2 boast some impressive specs with it’s 5.5-inch 1080p display. It is having 3GB of RAM coupled with 32GB of internal storage. It also runs Android Marshmallow out of the box. It is also having a 16MP rear camera with 4K recording. On the front, it is having 8MP camera with Full HD support. The LeEco Le2 sports USB Type-C for faster charging & connectivity.

The company has scheduled an event for 20th April. So we can see this device at that event.

Specs of LeEco Le 2:

  • 5.5-inch Full HD display
  • 3GB of RAM
  • 2.0 GHz Deca-Core MediaTek Helio X25 processor
  • 16 MP rear camera with 4K recording
  • 8MP front camera with 1080p
  • Android Marshmallow 6.0.1
  • USB Type C
Shivam Singh

Shivam defines himself as a gadget lover and likes to cover every news related to gadgets. He has more than 4 years of blogging experience and is Senior Editor at GadgetOx. He has been covering Tech and Gadget news on other well-known Tech sites WinCentral and Nokiapoweruser since long.

His other interests include driving and traveling.

Write to him at Email: [email protected]

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