It was reported that MediaTek’s Helio X25 chipset will be exclusive to Meizu for their Pro 6 handset which is expected to be launched very soon. Mediatek Helio X25 is a Deca-Core(10-Core) chipset with two A-72 architecture ,four A-53 cores big ones and four A-53 smaller ones.
But now it seems like other vendors are also getting attracted towards the Helio X25 chipset. The LeEco Le 2 phone has been leaked on the GFXBench website which is a very popular benchmarking website.
The LeEco Le2 boast some impressive specs with it’s 5.5-inch 1080p display. It is having 3GB of RAM coupled with 32GB of internal storage. It also runs Android Marshmallow out of the box. It is also having a 16MP rear camera with 4K recording. On the front, it is having 8MP camera with Full HD support. The LeEco Le2 sports USB Type-C for faster charging & connectivity.
The company has scheduled an event for 20th April. So we can see this device at that event.
Specs of LeEco Le 2:
- 5.5-inch Full HD display
- 3GB of RAM
- 2.0 GHz Deca-Core MediaTek Helio X25 processor
- 16 MP rear camera with 4K recording
- 8MP front camera with 1080p
- Android Marshmallow 6.0.1
- USB Type C